-0- no. stse-ce2177a specifications for nichia bluish-green led model : NSPE590S nichia corporation
-1- nichia stse-ce2177a 1.specifications (1) absolute maximum ratings (ta=25c) item symbol absolute maximum rating unit forward current i f 30 ma pulse forward current i fp 100 ma reverse voltage v r 5 v power dissipation p d 120 mw operating temperature t opr -30 ~ + 85 c storage temperature t stg -40 ~ +100 c soldering temperature t sld 265c for 10sec. i fp conditions : pulse width 10msec. and duty 1/10 (2) initial electrical/optical characteristics (ta=25c) item symbol condition min. typ. max. unit forward voltage v f i f =10[ma] - 3.5 4.0 v reverse current i r v r = 5[v] - - 50 a luminous intensity rank ie3 iv i f =10[ma] 4200 12000 - mcd ! measurement uncertainty of the luminous intensity : 10% color rank (i f =10ma,ta=25c) rank ie3 x 0.03 0.03 0.17 0.17 y 0.44 0.70 0.70 0.44 ! measurement uncertainty of the color coordinates : 0.012 average value by shipment lot (i f =10ma,ta=25c) item symbol average control x color coordinates (average) y ( x, y ) conforms to the ite red color requirement. luminous intensity (average) iv iv > 10000mcd. 2.typical initial optical/electrical characteristics please refer to figure?s page. 3.outline dimensions and materials please refer to figure?s page. material as follows ; resin(mold) : epoxy resin leadframe : ag plating copper alloy < = < =
-2- nichia stse-ce2177a 4.packaging the bg-leds are packed in cardboard boxes after pack aging in anti-electrostatic bags. according to the total delivery amount, cardboard boxes will be used to protect the bg-leds from mechanical shocks during transportation. please refer to figure?s page. the label on the minimum packing unit bag shows; part number, lot number, ranking, quantity the boxes are not water resistant and therefore must be kept away from water and moisture. 5.lot number the first six digits number shows lot number . the lot number is composed of the following characters; "#$$$$ - ! % " - year ( 1 for 2001, 2 for 2002 ) # - month ( 1 for jan., 9 for sep., a for oct., b for nov.) $$$$ - nichia's product number ! % - ranking
-3- nichia stse-ce2177a 6.reliability (1) test items and results test item standard test method test conditions note number of damaged resistance to soldering heat jeita ed-4701 300 302 tsld=260 5c, 10sec. 3mm from the base of the epoxy bulb 1 time 0/100 solderability jeita ed-4701 300 303 tsld=235 5c, 5sec. (using flux) 1 time over 95% 0/100 thermal shock jeita ed-4701 300 307 0c ~ 100c 15sec. 15sec. 100 cycles 0/100 temperature cycle jeita ed-4701 100 105 -40c ~ 25c ~ 100c ~ 25c 30min. 5min. 30min. 5min. 100 cycles 0/100 moisture resistance cyclic jeita ed-4701 200 203 25c ~ 65c ~ -10c 90%rh 24hrs./1cycle 10 cycles 0/100 terminal strength (bending test) jeita ed-4701 400 401 load 5n (0.5kgf) 0 ~ 90 ~ 0 bend 2 times no noticeable damage 0/100 terminal strength (pull test) jeita ed-4701 400 401 load 10n (1kgf) 10 1 sec. no noticeable damage 0/100 high temperature storage jeita ed-4701 200 201 ta=100c 1000hrs. 0/100 temperature humidity storage jeita ed-4701 100 103 ta=60c, rh=90% 1000hrs. 0/100 low temperature storage jeita ed-4701 200 202 ta=-40c 1000hrs. 0/100 steady state operating life ta=25c, i f =30ma 1000hrs. 0/100 steady state operating life of high humidity heat 60c, rh=90%, i f =20ma 500hrs. 0/100 steady state operating life of low temperature ta=-30c, i f =20ma 1000hrs. 0/100 (2) criteria for judging the damage criteria for judgement item symbol test conditions min. max. forward voltage v f i f =10ma - u.s.l.*) $ 1.1 reverse current i r v r =5v - u.s.l.*) $ 2.0 luminous intensity i v i f =10ma l.s.l.**) $ 0.7 - *) u.s.l. : upper standard level **) l.s.l. : lower standard level
-4- nichia stse-ce2177a 7.cautions (1) lead forming when forming leads, the leads should be bent at a point at least 3mm from the base of the epoxy bulb. do not use the base of the leadframe as a fulcrum during lead forming. lead forming should be done before soldering. do not apply any bending stress to the base of the lead. the stress to the base may damage the bg-led?s characteristics or it may break the bg-leds. when mounting the bg-leds onto a printed circuit board, the holes on the circuit board should be exactly aligned with the leads of the bg-leds. if the bg-leds are mounted with stress at the leads, it causes deterioration of the epoxy resin and this will degrade the bg-leds. (2) storage the bg-leds should be stored at 30c or less and 70%rh or less after being shipped from nichia and the storage life limits are 3 months. if the bg-leds are stored for 3 months or more, they can be stored for a year in a sealed container with a nitrogen atmosphere and moisture absorbent material. nichia bg-led electrode sections are comprised of a silver plated copper alloy. the silver surface may be affected by environments which contain corrosive gases and so on. please avoid conditions which may cause the bg-led to corrode, tarnish or discolor. this corrosion or discoloration may cause difficulty during soldering operations. it is reco mmended that the bg-leds be used as soon as possible. please avoid rapid transitions in ambient temperature, especially, in high humidity environments where condensation can occur. (3) static electricity static electricity or surge voltage damages the bg-leds. it is recommended that a wrist band or an anti-el ectrostatic glove be used when handling the bg-leds. all devices, equipment and machinery must be properly grounded. it is recommended that measures be taken against surge voltage to the equipment that mounts the bg-leds. when inspecting the final products in which bg-leds were assembled, it is recommended to check whether the assembled bg-leds are damaged by static electricity or not. it is easy to find static-damaged bg-leds by a light-on test or a vf test at a lower current (below 1ma is recommended). damaged bg-leds will show some unusual characteristics such as the leak current remarkably increases, the forward voltage becomes lower, or the bg-leds do not light at the low current. criteria : (v f > 2.0v at i f =0.5ma)
-5- nichia stse-ce2177a (4) soldering conditions nichia bg-led leadframes are comprised of a silver plated copper alloy. this substance has a low thermal coefficient (easily conducts heat). careful attention should be paid during soldering. solder the bg-led no closer than 3mm from the base of the epoxy bulb. soldering beyond the base of the tie bar is recommended. recommended soldering conditions dip soldering soldering pre-heat pre-heat time solder bath temperature dipping time dipping position 100c max. 60 seconds max. 260c max. 10 seconds max. no lower than 3 mm from the base of the epoxy bulb. temperature soldering time position 300c max. 3 seconds max. no closer than 3 mm from the base of the epoxy bulb. do not apply any stress to the lead particularly when heated. the bg-leds must not be repositioned after soldering. after soldering the bg-leds, the epoxy bulb should be protected from mechanical shock or vibration until the bg-leds return to room temperature. direct soldering onto a pc board should be avoided. mechanical stress to the resin may be caused from warping of the pc board or from the clinching and cutting of the leadframes. when it is absolutely necessary, the bg-leds may be mounted in this fashion but the user will assume responsibility for any problems. direct solderi ng should only be done after testing has confirmed that no damage, such as wire bond failure or resin dete rioration, will occur. nichia?s bg-leds should not be soldered directly to double sided pc boards because the heat will deteriorate the epoxy resin. when it is necessary to clamp the bg-leds to prevent soldering failure, it is important to minimize the mechanical stress on the bg-leds. cut the bg-led leadframes at room temperature. cutting the leadframes at high temperatures may cause failure of the bg-leds. (5) heat generation thermal design of the end product is of paramount importance. please consider the heat generation of the bg-led when making the system design. the coefficient of temperature increase per input electric power is affected by the thermal resi stance of the circuit board and density of bg-led placement on the board, as well as other components. it is necessary to avoid intense heat generation and operate within the maximum ratings given in this specification. the operating current should be decided after considering the ambient maximum temperature of bg-leds. (6) cleaning it is recommended that isopropyl alcohol be used as a solvent for cleaning the bg-leds. when using other solvents, it should be confirmed beforehand whether the solvents will dissolve the package and the resin or not. freon solvents should not be used to clean the bg-leds because of worldwide regulations. do not clean the bg-leds by the ultrasonic. when it is absolutely necessary, the influence of ultrasonic cleaning on the bg-leds depends on factors such as ultrasonic power and the assembled condition. before cleaning, a pre-test should be done to c onfirm whether any damage to the bg-leds will occur.
-6- nichia stse-ce2177a (7) safety guideline for human eyes in 1993, the international electric committee (iec) issued a standard concerning laser product safety (iec 825-1). since then, this standard has been applied for diffused light sources (bg-leds) as well as lasers. in 1998 iec 60825-1 edition 1.1 evaluated the magnitude of the light source. in 2001 iec 60825-1 amendment 2 converted the laser class into 7 classes for end products. components are excluded from this system. products which contain visible bg-leds are now classified as class 1. products containing uv leds are class 1m. products containing bg-leds can be classified as class 2 in cases where viewing angles are narrow, optical manipulation intensifies the light, and/or the energy emitted is high. for these systems it is recommended to avoid long term exposure. it is also recommended to follow the iec regulations regarding safety and labeling of products. (8) others if the bg-leds are being used after being fixed into a case (container, box, etc...) the bg-leds must not be mounted so that the epoxy lens is pressed or glued onto a plastic (or metal) board. these bg-leds are designed and manufactured for standard applications of traffic signals. it is recommended to consult with nichia in adva nce if these bg-leds are used for other applications. user shall not reverse engineer by disassembling or analysis of the bg-leds without having prior written consent from nichia. when defective bg-leds are found, the user shall inform nichia directly before disassembling or analysis. the formal specifications must be exchanged and signed by both parties before large volume purchase begins. the appearance and specifications of the product may be modified for improvement without notice.
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 00.10.20.30.4 0.5 0.6 0.7 0.8 500 510 490 520 630 620 610 600 590 580 570 530 560 550 540 460 470 480 ite (green) y x ici chromaticity diagram nichia stse-ce2177a -7-
allowable forward current i f (ma) relative luminosity (a.u.) relative luminosity (a.u.) forward current i fp (ma) allowable forward current i fp (ma) ambient temperature vs. allowable forward current ambient temperature ta (c ) ambient temperature vs. relative luminosity ambient temperature ta ( c ) ambient temperature vs. forward voltage ambient temperature ta ( c ) forward voltage v f (v) duty ratio (%) forward current vs. relative luminosity forward current i fp (ma) forward voltage v f (v) forward voltage vs. forward current duty ratio vs. allowable forward current 0 204060 100120 80 5.0 4.0 2.0 1.0 0 3.0 2.0 1.0 0.5 0.2 200 100 50 20 10 5 1 1 5 10 20 100 50 020 6080100 40 -40 -20 0 20 60 80 100 40 -40 -20 60 80 100 40 020 200 100 50 20 10 30 40 30 20 0 10 2.5 3.0 3.5 4.0 4.5 5.5 5.0 ta=25c ta=25c ta=25c i fp =5ma i fp =10ma i fp =30ma i fp =10ma 5.0 4.2 3.4 3.0 2.6 3.8 4.6 -8- n ichia stse-ce2177a typ.characteristics model nspexxxx nichia corporation title no. 011130110011
directivity (NSPE590S) radiation angle 0 10 20 30 40 50 60 70 80 90 1 0.5 0 spectrum forward current vs. chromaticity coordinate ( d ) y relative emission intensity (a.u.) forward current i fp (ma) ambient temperature ta (c) xx wavelength (nm) relative luminosity (a.u.) 0 30 0.5 90 60 1 151020100 50 0 0.05 0.10 0.15 0.20 0.25 0.70 0.65 0.60 0.55 0.50 0.45 020 6080100 40 -40 -20 350 400 450 500 600 650 550 1.2 1 0.8 0.4 0.2 0 0.6 517 513 505 497 509 501 direct current pulsating current ta=25c 1ma(510nm) 5ma(507nm) 10ma(505nm) 30ma(501nm) i fp =10ma ta=25c ta=25c i f =10ma ta=25c i f =10ma ! applied voltage waveform pulsating current (full-wave rectification) direct current t t v v 511 507 505 499 509 503 501 ambient temperature vs. dominant wavelength dominant wavel ength d (nm) forward current vs. dominant wavelength ! dominant wavel ength d (nm) n ichia stse-ce2177a typ.characteristics model NSPE590S nichia corporation title no. 011130110031 -9-
! 0.5 0.05 anode cathode 1 (2) 29.7 1 8.9 7.9 1.1 (2.5) 5 5.3 13.2 0.5 5.6 1.5max. 1 0.3 0.3 stopper item materials resin(mold) epoxy resin lead frame ag plating copper alloy remark : bare copper alloy is exposed at tie-bar portion after cutting. the lamps have sharp and hard points that may injure human eyes or fingers etc., so please pay enough care in the handling. nichia stse-ce2177a -10- uni t mm allow nichia corporation n o. outline dimensions 010903106051 title model n spe590s 0.2 scal e 3/1
anti-electrostatic bag cardboard box 360 ! 135 ! 215 ! 4t cardboard cardboard print label the quantity is printed on this bag. " put this label on the cardboard box. n i c h i a xxxx led type nxpxxxxxx lot xxxxxx- ! # qty pcs nichia corporation 491 oka,kaminaka,anan,tokushima,japan caution to electrostatic damage ??? xxxx led type nxpxxxxxx qty pcs n ichia nichia corporation 491 oka, kaminaka, anan, tokushima, japan " one box contains 8 bags at maximum. nichia stse-ce2177a -11- nichia corporation n o. packing 020723201101 title model nxpxxxxxx
anti-electrostatic bag cardboard box b 360 ! 135 ! 215 ! 4t cardboard cardboard cardboard box a " the cardboard box b contains 2 cardboard box a at maximum. print label " put this label on the cardboard box b. the quantity is printed on this bag. n i c h i a xxxx led type nxpxxxxxx lot xxxxxx- ! # qty pcs nichia corporation 491 oka,kaminaka,anan,tokushima,japan caution to electrostatic damage !"#$%& xxxx led type nxpxxxxxx qty pcs n ichia nichia corporation 491 oka, kaminaka, anan, tokushima, japan nichia stse-ce2177a -12- nichia corporation n o. packing 020723201111 title model nxpxxxxxx
cardboard box 425 ! 135 ! 355 ! 4t cardboard cardboard anti-electrostatic bag print label n i c h i a xxxx led type nxpxxxxxx lot xxxxxx- ! # qty pcs nichia corporation 491 oka,kaminaka,anan,tokushima,japan caution to electrostatic damage !"#$%& the quantity is printed on this bag. " put this label on the cardboard box. " one box contains 20 bags at maximum. xxxx led type nxpxxxxxx qty pcs n ichia nichia corporation 491 oka, kaminaka, anan, tokushima, japan nichia stse-ce2177a -13- nichia corporation n o. packing 020723201121 title model nxpxxxxxx
" the cardboard box b contains 4 cardboard box a at maximum. anti-electrostatic bag cardboard box b 425 ! 135 ! 355 ! 4t cardboard cardboard box a cardboard print label the quantity is printed on this bag. " put this label on the cardboard box b. n i c h i a xxxx led type nxpxxxxxx lot xxxxxx- ! # qty pcs nichia corporation 491 oka,kaminaka,anan,tokushima,japan caution to electrostatic damage !"#$%& xxxx led type nxpxxxxxx qty pcs n ichia nichia corporation 491 oka, kaminaka, anan, tokushima, japan nichia stse-ce2177a -14- nichia corporation n o. packing 020723201131 title model nxpxxxxxx
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